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Guild: wafer.space Community
Channel: ℹ️ - Information / ⁉️-questions / Unused pad
After: 2025-11-30 11:59 p.m.
Before: 2026-01-01 12:00 a.m.
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[2025-12-01 4:29 a.m.] xintingjiang_36756
Hi all,
When using the gf180mcuD padframe template, what’s the recommended way to handle unused pads? Should I keep the pad cells in place to maintain a complete pad ring, and configure the unused signal pads as inputs with a weak pull-down (or another default) while leaving them unbonded/unconnected?

Thanks!


[2025-12-01 4:51 a.m.] _luke_w_
If you want to be bond-compatible with the COB design then you need to keep the same number of pads on each edge, and keep all of the VDD and VSS pads in the same locations


[2025-12-01 4:52 a.m.] _luke_w_
Yes I'd recommend a pull-down, otherwise pads can float up to mid rail and start drawing current. The pulls are pretty weak, like 100k or so.

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[2025-12-01 7:08 a.m.] xintingjiang_36756
So that would be using input digital pad; gf180mcu_fd_io__in_c and set PD=1 PU=0?


[2025-12-01 2:27 p.m.] _luke_w_
That works, or using the bidi with `IE = OE = 0` would work too


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